SikaBond® T-55 J

• LEED® EQc 4.1
• SCAQMD, Rule 1168
• BAAQMD, Reg. 8, Rule 51

Polyurethane

SikaBond® T-55 J has a shelf life of 12 months from the date of production, if it is stored properly in undamaged, original, sealed packaging, and if the storage conditions are met.

SikaBond® T-55 J shall be stored in dry conditions, protected from direct sunlight and at temperatures between +5 °C and +25 °C.

+5 °C to +40 °C

SikaBond® T-55 J spreads very easily whilst maintaining stable trowel ridges.

+15 °C to +35 °C

40% to 70%

During laying and until SikaBond® T-55 J has fully cured, the substrate and ambient temperatures shall be between +15 °C and +35 °C, and between +20 °C and +35 °C with underfloor heating.

Permissible substrate moisture content without underfloor heating:

• 2.5% CM for cement screeds.
• 0.5% CM for anhydrite screeds.
• 3–12% CM for magnetite flooring (depending on the organic content).

Permissible substrate moisture content for use with underfloor heating:

• 1.8% CM for cement screeds.
• 0.3% CM for anhydrite screeds.
• 3–12% CM for magnetite flooring (depending on the organic content).

Note: For all moisture contents, the quality of the substrates and surfaces, always follow the guidelines of the wood flooring manufacturer.

3.0 mm/24 hours approx. (23 °C / 50% r.h.)

60 minutes approx. (23 °C / 50% r.h.)

Full Surface Bonding:

• 600−800 g/m² with notched trowel B3 (TKB Germany) e.g. for lam parquet, mosaic parquet and industrial parquet.
• 700−900 g/m² with notched trowel B6 (TKB Germany) or SC+ MB (US Standard) e.g. for engineered wood strips and planks, lam and mosaic parquet.
• 800−1000 g/m² with notched trowel B11 (TKB Germany) or P5 (US Standard) e.g. solid wood, engineered long-strips and panels, industrial parquet, other residential wood floors and paving, and chipboard.

For bonding long or wide boards and on uneven substrates, it may be necessary to use a larger notched trowel to ensure that a sufficient amount of SikaBond® T-55 J is applied to provide a uniform adhesive bed to prevent hollow sections without full surface bond.
For substrates primed with Sika^® Primer MB, the consumption of SikaBond® T-55 J may be reduced.

For the application of SikaBond® T-55 J all standard construction guidelines apply.
For further information, please refer to the Method Statement "Full Surface Bonding".

• The substrate must be clean, dry, sound and homogeneous, free from oils, grease, dust and loose or friable particles. Paint, cement laitance and other poorly adhering contaminants must be removed.
• Concrete and/or cement screeds must be ground and thoroughly cleaned with an industrial vacuum.
• Anhydrite screeds, including flowable anhydrite screeds must be ground and thoroughly cleaned with an industrial vacuum shortly before bonding with the adhesive starts.
• Broadcast mastic asphalt must be primed with Sika^® Primer MB. Refer to the Product Data Sheet for further application details.
• Glazed ceramic and old existing ceramic tiles must be degreased and cleaned with Sika^® Aktivator-205, or the tile surfaces must be ground and then thoroughly cleaned with an industrial vacuum.
• Wood and/or gypsum boards (e.g. chipboard, plywood) must be glued and/or screwed to the substructure in order to be fixed to the substrate. For floating dry-floors, contact our Technical Service Department.
• For other substrates contact our Technical Service Department for advice and assistance.
• SikaBond® T-55 J can be used without priming on cement based floors, anhydrite floors, chipboards, concrete and ceramic tiles.
• For broadcasted mastic asphalt, cement based floors with excessive moisture content and use over old adhesive residues or on weak substrates use Sika^® Primer MB. For detailed instructions contact our Technical Service Department.

Clean all tools and application equipment immediately after use with Sika® Remover-208 and/or Sika® Colma Cleaner. Once cured, residual material can only be removed mechanically.